doc. no : qw0905-LSRG3392-PF rev. : a date : 27 - apr. - 2006 pb data sheet LSRG3392-PF lead-free parts durl color led lamps ligitek electronics co.,ltd. property of ligitek only
note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 50% -60 75% 100% -30 directivity radiation 60 75% 25% 0 50% 25%100% 0 30 1.5 max 2.0min 2.54typ 1 2 3 0.5 typ package dimensions part no. LSRG3392-PF sr 10.5 0.5 g 18.0min 1.anode green 2.common cathode 3.anode red 2.54typ 2.0min + 3 - 2 + 1 8.6 7.6 5.9 5.0 ligitek electronics co.,ltd. property of ligitek only page 1/6
-40 ~ +85 operating temperature t opr viewing angle 2 1/2 (deg) peak wave length pnm LSRG3392-PF note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. 565 gap green red emitted gaalas white diffused 660 lens 2.6 1.72142 70 30 max. 20 1.5 2.4 min. 70 6.5 12 typ. min. typical electrical & optical characteristics (ta=25 ) material part no color forward voltage @20ma(v) spectral halfwidth nm luminous intensity @20ma(mcd) storage temperature tstg -40 ~ +100 2/6 page 15 ma 30 forward current i f reverse current @5v ir peak forward current duty 1/10@10khz power dissipationpd i fp 10 a 10050 10080 mw ma absolute maximum ratings at ta=25 parameter symbol g sr ratings unit ligitek electronics co.,ltd. property of ligitek only part no. LSRG3392-PF
fig.4 relative intensity vs. temperature 1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 600 0.0 0.5 650700750 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 -40 0.8 -20 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 80 40 20 060100 0.0 2.5 1.5 1.0 2.0 3.0 ambient temperature( ) -40-2002060 40100 80 3.0 2.5 2.0 1.5 1.0 0.5 0.0 ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current typical electro-optical characteristics curve 2.0 fig.1 forward current vs. forward voltage forward voltage(v) 100 f o r w a r d c u r r e n t ( m a ) 1.0 0.1 10 1.0 sr chip 1000 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 3.04.05.0 3/6 page forward current(ma) 1.0101001000 part no. LSRG3392-PF
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip fig.6 directive radiation 4/6 part no. LSRG3392-PF
temp( c) 260 120 time(sec) 0 60 seconds max preheat 0 50 25 2 /sec max 100 150 5 /sec max 260 c3sec max soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) 2.wave soldering profile dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only page 5/6 part no. LSRG3392-PF
this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. solderability test 1.t.sol=230 5 2.dwell time=5 1sec mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 this test intended to see soldering well performed or not. low temperature storage test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) thermal shock test solder resistance test 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles high temperature high humidity test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs high temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) test item operating life test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) test condition reliability test: jis c 7021: b-12 the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-202:103b jis c 7021: b-11 the purpose of this test is the resistance of the device under tropical for hours. mil-std-883:1008 jis c 7021: b-10 the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 reference standard this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. description page 6/6 ligitek electronics co.,ltd. property of ligitek only part no. LSRG3392-PF
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